EINDHOVEN, Netherlands and IRVINE, Calif., March 29, 2012 – NXP Semiconductors N.V. (NASDAQ: NXPI) and HID Global, both trusted leaders in solutions for the delivery of secure identity, today announced their collaboration to introduce a global, generic Mobile Access solution for NFC-enabled mobile phones. NFC enables the secure and convenient sharing of information from one device to another over short distances based upon existing contactless standards, making it ideal for deploying easy-to use mobile access control applications.
HID Global and NXP helped create the current market for card-based physical access systems and are now jointly moving these solutions to mobile phones as NFC becomes a standard feature.
The contactless cards that employees use to enter corporate buildings and parking garages can now be transferred to an NFC-enabled phone storing digital access credentials. The credentials are stored on NXP’s embedded Secure Element within the handset and are presented by the mobile phone in a manner that is compatible with access control readers and systems. As the use of NFC smart phones for access control becomes increasingly more popular, consumers and enterprises can expect the same high level of security with improved convenience on a mobile device.
The jointly developed solution also leverages NXP and HID Global advanced reader technologies within a physical access control infrastructure. The solution supports existing HID Global readers and those based on the company’s iCLASS SIO-Enabled (iCLASS SE®) platform that fuels the migration of physical access control technology beyond traditional cards and readers by enabling deployment of mobile access with digital credentials. HID’s iCLASS SE readers will be powered by NXP’s new CLRC663 reader ICs and fully support 13.56 MHz smart cards that are ISO14443 compliant, including MIFARE DESFIRE EV1.
To ensure maximum compatibility, the new Mobile Access management solution from NXP and HID Global is backward-compatible with newer HID Global iCLASS® readers, and is forward-compatible to HID Global’s Trusted Identity Platform® (TIP™) ecosystem. Existing HID customers can upgrade certain iCLASS implementations to support the use of NFC-enabled mobile phones without the need to physically replace the installed readers. NXP’s technology supports the management of multiple applications such as payment, e-government, access management and ticketing, all via one microcontroller that assures secure and convenient recognition without compromising security, performance and design productivity.
Dr. Selva Selvaratnam, senior vice president and chief technology officer with HID Global, said, “NXP is playing a vital role in the adoption of NFC technology among handset manufacturers and developer communities. By working together, this application can be deployed immediately on a significant number of mobile phones. We are excited to team up and combine our leadership positions in the access management market to offer the industry new leading-edge solutions.”
Henri Ardevol, vice president and general manager, secure transactions with NXP Semiconductors, said, “We are very pleased to co-operate with HID Global on the development of this new solution. As leading enterprises continue to invest in mobile technology and security infrastructure, our collaboration brings real value and convenience around the world. In addition, combining HID Global’s iCLASS SE readers with our MIFARE DESFire and NFC technology ensures greater interoperability in access management and accelerates adoption of NFC applications within the enterprise space.”
NXP and HID Global have based their Mobile Access solution on NXP’s PN65 family of NFC ICs for low power, high-performance communication and tamper-resistant secure data storage. The PN65 features NXP’s market leading, high performance NFC radio controller PN544 and an embedded Secure Element (eSE). The eSE incorporates NXP’s advanced SmartMX technology used to safeguard hundreds of millions of bank cards; electronic passports and eID cards; transportation tickets; and other card and credentials around the world. The NXP ICs will support HID Global’s Secure Identity Object (SIO™) technology for portable credential provisioning, storage and lifecycle management, and HID’s Trusted Identity Platform (TIP) for endpoint management and security. HID’s SIOs introduce a new standards-based, technology-independent and flexible identity data structure that enables smart card technologies to be deployed for use on a wide range of portable platforms including NFC phones. The SIO data structure provides new levels of security, portability and performance, and makes it possible for facility and security managers to remotely manage credential provisioning on designated mobile devices. It also enables them to dynamically increase security levels and address future changes in requirements via simple firmware updates.
About HID Global
HID Global is the trusted source for secure identity solutions for millions of customers around the world. Recognized for robust quality, innovative designs and industry leadership, HID Global is the supplier of choice for OEMs, system integrators, and application developers serving a variety of markets. These markets include physical and logical access control, including strong authentication and credential management; card printing and personalization; highly secure government ID; and identification technologies used in animal ID and industry and logistics applications. The company's primary brands include HID®, ActivIdentity™, FARGO®, and LaserCard®. Headquartered in Irvine, California, HID Global has over 2,100 employees worldwide and operates international offices that support more than 100 countries. HID Global is an ASSA ABLOY Group brand. For more information, visit www.hidglobal.com
About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.2 billion in 2011. Additional information can be found by visiting www.nxp.com.
This document includes forward-looking statements which include statements regarding NXP’s business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions; the ability to successfully introduce new technologies and products; the end-market demand for the goods into which NXP’s products are incorporated; the ability to generate sufficient cash, raise sufficient capital or refinance corporate debt at or before maturity; the ability to meet the combination of corporate debt service, research and development and capital investment requirements; the ability to accurately estimate demand and match manufacturing production capacity accordingly or obtain supplies from third-party producers; the access to production capacity from third-party outsourcing partners; any events that might affect third-party business partners or NXP’s relationship with them; the ability to secure adequate and timely supply of equipment and materials from suppliers; the ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly; the ability to form strategic partnerships and joint ventures and to successfully cooperate with alliance partners; the ability to win competitive bid selection processes to develop products for use in customers’ equipment and products; the ability to successfully establish a brand identity; the ability to successfully hire and retain key management and senior product architects; and, the ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and NXP’s business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, NXP’s market segments and product areas may develop. NXP has based these assumptions on information currently available, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While NXP does not know what impact any such differences may have on its business, if there are such differences, its future results of operations and its financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, www.nxp.com/investor or from the SEC website, www.sec.gov.
For further information, please contact:
USA: Rebecca Samuel
Tel. +1 408 474 8769
Europe: Michael Maader
Tel. +49 (0)40 5613 3371
APAC: Lilian Li
Tel: +86 21 22052615
Global: Jeremy Hyatt
Tel. +1 949 732 2177