Company holds leadership position across the broadest portfolio of inlays, prelaminates, readers and card personalization systems
IRVINE, Calif., July 27, 2010 – HID Global, trusted leader in solutions for the delivery of secure identity, today announced that it surpassed its 100 millionth product shipment of e-government inlays and prelaminates to 28 countries worldwide this month. With the broadest portfolio of e-doc, e-passport and e-national IDsolutions in the market, HID Global is an innovator and developer in the deployment of two of the most wide-spread technologies for extended durability of contactless e-documents—wire transfer and wire embedding technologies. Additionally, the company developed and patented ceFLEX™—a thin, flexible high-tech inlay material that increases e-document resiliency.
"This milestone proves that our e-government solutions have achieved unprecedented customer acceptance. Countries worldwide continue to look to HID Global for innovative e-doc, e-passport and e-national ID solutions, said Mark Scaparro, senior vice president of Identification Solutions (IDS) at HID Global. "With over 15 years of unique expertise around RFID through our Genuine HID inlays, prelaminates, readers and printers/encoders, as well as our proven wire embedding and wire transfer innovations, HID Global is well poised to meet the rapidly escalating demands for e-government solutions worldwide."
Acuity Market Intelligence has projected that e-passport market revenues will reach nearly $7 billion annually by the end of 2014, with a compounded annual growth rate of 31.5 percent. In its April study entitled "The Global e-passport and e-visa Industry Report," the firm said that 88 percent of all passports issued in 2014 will be electronic passports. Acuity said e-passports accounted for 57 percent of all passports issued and 28 percent of all passports in circulation during 2009.
"The recent expansion of HID Global's e-government campus in Connemara, Galway, Ireland, enables us to meet the growing demand for product and service solutions for government agencies worldwide," said Jason Bohrer, senior vice president, HID Global Operations. "Our expanded e-government operations give us significantly higher production capacity for our microchip-based inlays, which are used as core components in the manufacture of e-documents, e-passports and e-national IDs."
Additional information on the complete portfolio of HID Global e-government solutions can be found at www.hidglobal.com/ids/eGovernment.php.