HID Global Introduces the Industry’s Smallest High Frequency Direct Bonding Technology

News Highlights:


  • First high frequency (HF) chip-and-antenna combos produced with patented HID Global direct bonding process with Vigo HF technology
  • Process ensures thinner, smaller HF chip-and-antenna combos, with uncompromised reliability and performance
  • The Vigo units’ compact sizes empower designers to embed HF RFID capability into a broader range card and tag form factors

AUSTIN, Texas., Jan. 28, 2014HID Global®, a worldwide leader in secure identity solutions, today announced that its Identification Technologies division is producing Vigo™ high frequency (HF) technology, the first ISO 15693 - HF (13.56 MHz) chips assembled with HID Global direct bonding technology. Direct bonding allows the secure attachment of antennas to chips without the bulk of added modules, making Vigo units the smallest HF formats available in the market that deliver uncompromised performance.

Direct bonding technology has proven effective for HID Global in placing hundreds of millions of low frequency (LF) chips into a wide variety of ever shrinking form factors. “By minimizing the space requirements for chips and antennas, HID Global is able to maximize opportunities for embedding radio radio frequency identification (RFID) into LF applications,” said Richard Aufreiter, director of product management for Identification Technologies with HID Global. “With the introduction of Vigo technology, HID Global brings that same potential to space-restricted HF systems.”

The patented HID Global direct bonding process enables precise connection of ultra-thin copper wire RFID antennas to micro-sized chips, ensuring Vigo units are thinner and smaller than comparable chip-and-antenna combos, ensuring excellent reliability and performance. By eliminating requirements for bulky module housings or additional soldering material, direct bonding also produces finished units that are more cost effective.

Integrators and end-users of HF RFID systems will find the Vigo units’ small sizes adaptable to a broader range of form factors and potential applications including consumables, brand protection, medical, and on- and off-metal asset tracking.

Vigo features:

·       ISO 15693 / ISO18000-3 standard compliant at 13.56 MHz

·       64 bit UID and 1 Kbit, 1.6 Kbit or 2 Kbit user programmable memory

·       32 bit password protection for functionality and data

·       Direct bonding of chip to antenna 

“Demand for increasingly smaller RFID products is on the rise” said Aufreiter.  “HID Global is currently integrating the new Vigo technology into a complete portfolio of upcoming micro-sized RFID products that will take HF industrial tags to the next level of miniaturization.”

For more details, download the HID Global Direct Bonding whitepaper.

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About HID Global
HID Global is the trusted source for innovative products, services, solutions, and know-how related to the creation, use, and management of secure identities for millions of customers around the world. The company’s served markets include physical and logical access control, including strong authentication and credential management; card printing and personalization; visitor management systems; highly secure government and citizen ID; and identification RFID technologies used in animal ID and industry and logistics applications. The company’s primary brands include ActivID®, EasyLobby®, FARGO®, IdenTrust®, LaserCard® and HID®. Headquartered in Austin, Texas, HID Global has over 2,100 employees worldwide and operates international offices that support more than 100 countries. HID Global® is an ASSA ABLOY Group brand. For more information, visit www.hidglobal.com.

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®HID, HID logo and Vigo are trademarks or registered trademarks of HID Global Corp in the U.S. and/or other countries. All other trademarks, service marks, and product or service names are trademarks or registered trademarks of their respective owners.

Media Contact:
Jeremy Hyatt
Director, Global Public Relations
[email protected]